Abstract

An integrated circuit chip comprising a bond wire and a mass of magnetic material provided on the bond wire, wherein the mass of magnetic material increases the inductance of the bond wire.

Document Type

Patent

Patent Number

US 7,719,112

Application Serial Number

11/835,144

Issue Date

5-18-2010

Current Assignee

UCFRF

Assignee at Issuance

UCFRF

College

College of Engineering and Computer Science (CECS)

Department

Electrical & Computer Engineering

Allowance Date

1-8-2010

Filing Date

8-7-2007

Assignee at Filing

u

Filing Type

Nonprovisional Application Record

Donated

no

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