Abstract

Experimental modal analysis (EMA) is used as a non-destructive technique for the evaluation of Space Shuttle thermal protection system (TPS) tile bond integrity. Finite element (FE) models for tile systems were developed and were used to generate their vibration characteristics (i.e. natural frequencies and mode shapes). Various TPS tile assembly configurations as well as different bond conditions were analyzed. Results of finite element analyses demonstrated a drop in natural frequencies and a change in mode shapes which correlate with both size and location of disband. Results of experimental testing of tile panels correlated with FE results and demonstrated the feasibility of EMA as a viable technique for tile bond verification. Finally, testing performed on the Space Shuttle Columbia using a laser doppler velocimeter demonstrated the application of EMA, when combined with FE modeling, as a non-contact, non-destructive bond evaluation technique.

Graduation Date

1992

Semester

Summer

Advisor

Moslehy, Faissal

Degree

Master of Science (M.S.)

College

College of Engineering

Department

Mechanical and Aerospace Engineering

Degree Program

Mechanical Engineering

Format

PDF

Pages

99 p.

Language

English

Rights

Written permission granted by copyright holder to the University of Central Florida Libraries to digitize and distribute for nonprofit, educational purposes.

Length of Campus-only Access

None

Access Status

Masters Thesis (Open Access)

Identifier

DP0028248

Subjects

Dissertations, Academic -- Engineering; Engineering -- Dissertations, Academic

Accessibility Status

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