Title
A Novel Lossy And Dispersive Interconnect Model For Integrated Circuit Simulation
Abstract
A method of modeling first-level metal interconnect signal transmission on silicon substrates with arbitrary doping profiles has been developed. The novel interconnect model includes the effects of signal attenuation and signal dispersion encountered in fast transient waveform propagation. Analytical modeling and PISCES device simulation are used for interconnect model development. SPICE simulation of the present model shows good agreement with measurement. © 1990 IEEE
Publication Date
1-1-1990
Publication Title
IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Volume
13
Issue
2
Number of Pages
275-280
Document Type
Article
Personal Identifier
scopus
DOI Link
https://doi.org/10.1109/33.56157
Copyright Status
Unknown
Socpus ID
0025448921 (Scopus)
Source API URL
https://api.elsevier.com/content/abstract/scopus_id/0025448921
STARS Citation
Yuan, Jiann Shiun; Eisenstadt, William R.; and Liou, Juin J., "A Novel Lossy And Dispersive Interconnect Model For Integrated Circuit Simulation" (1990). Scopus Export 1990s. 1644.
https://stars.library.ucf.edu/scopus1990/1644