Title

Wideband Electrical Characterization Of Materials Used In Mcm Applications

Keywords

Multichip Modules-Ceramic (MCM-C); Multichip Modules-Laminate (MCM-L); Wideband Materials Characterization

Abstract

The objective of this work is to conduct a comprehensive wideband electrical evaluation of materials and technologies used in multichip module fabrication. This paper presents a set of technics which can be used to assess the MCM technologies' electrical properties. As an illustration of this approach, an electrical comparison is made between laminate MCM (MCM-L) and ceramic MCM (MCM-C) technologies. In addition, a number of materials and fabrication technologies have been examined in order to compare the potential performance and to outline the range of viable applications for each material system and technology. This paper also describes a unique and novel resonant structure used to evaluate the electromagnetic properties of a number of electronic materials and technologies.

Publication Date

9-1-1996

Publication Title

International Journal of Microcircuits and Electronic Packaging

Volume

19

Issue

3

Number of Pages

281-286

Document Type

Article

Personal Identifier

scopus

Socpus ID

0030246404 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/0030246404

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