Title

Xps And Electrochemical Studies On Tungsten-Oxidizer Interaction In Chemical Mechanical Polishing

Abstract

Electrochemical interaction between the oxidizer and the metal is believed to play a key role in material removal in tungsten CMP. In this study, we use X-ray Photoelectron Spectroscopy (XPS) in conjunction with electrochemical measurements in both in-situ polishing conditions as well as in static solutions, to identify the passivation and dissolution modes of tungsten. Dissolution of tungsten oxides was found to be the primary non-mechanical tungsten removal mechanism in CMP. ©2000 Materials Research Society.

Publication Date

1-1-1999

Publication Title

Materials Research Society Symposium - Proceedings

Volume

566

Number of Pages

89-95

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1557/proc-566-89

Socpus ID

0033728501 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/0033728501

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