Title
Design Of A Dual Latent Heat Sink For Pulsed Electronic Systems
Abstract
A conceptual design of a dual latent heat sink basically intended for low thermal duty cycle electronic heat sink applications is presented. In addition to the concept, end-application-dependent criteria to select an optimized design for this dual latent heat sink are presented. A thermal resistance model has been developed to analyze and optimize the design, which would also serve as a fast design tool for experiments. The model showed that it is possible to have a dual latent heat sink design capable of handling 7 MJ of thermal load at a heat flux of 500 W/cm2 (over an area of 100 cm2) with a volume of 0.072 m3 and a weight of about 57.5 kg. It was also found that, with such high heat flux absorption capability, the proposed conceptual design can have a vapor-to-condenser temperature difference of less than 10°C with a volume storage density of 97 MJ/m3 and a mass storage density of 0.122 MJ/kg. Copyright © 2008 by the American Institute of Aeronautics and Astronautics, Inc. All rights reserved.
Publication Date
1-1-2008
Publication Title
Journal of Thermophysics and Heat Transfer
Volume
22
Issue
4
Number of Pages
572-580
Document Type
Article; Proceedings Paper
Personal Identifier
scopus
DOI Link
https://doi.org/10.2514/1.34998
Copyright Status
Unknown
Socpus ID
56249092822 (Scopus)
Source API URL
https://api.elsevier.com/content/abstract/scopus_id/56249092822
STARS Citation
Kota, Krishna M.; Chow, Louis C.; Du, Jianhua; Kapat, Jayanta S.; and Leland, Quinn, "Design Of A Dual Latent Heat Sink For Pulsed Electronic Systems" (2008). Scopus Export 2000s. 10816.
https://stars.library.ucf.edu/scopus2000/10816