Title

2.5-Dimensional Simulation For Analyzing Power Arrays Subject To Esd Stresses

Abstract

A new simulation-based methodology for analyzing the ESD performance of snapback multi-finger power arrays subject to ESD stress is developed and presented. The methodology utilizes a combination of a newly available 2.5-dimensional netlist extraction tool, ESD cell snapback compact model, and standard simulation CAD tools. Simulated snapback behavior and current distribution of power cells are demonstrated. © 2009 ESDA.

Publication Date

12-1-2009

Publication Title

Electrical Overstress/Electrostatic Discharge Symposium Proceedings

Number of Pages

-

Document Type

Article; Proceedings Paper

Personal Identifier

scopus

Socpus ID

77950998585 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/77950998585

This document is currently not available here.

Share

COinS