Title

Ultrasonic-Assisted Fabrication Of Highly Dispersed Copper/Multi-Walled Carbon Nanotube Nanowires

Keywords

Electroless copper plating; Multi-walled carbon nanotube; Nanowires; Ultrasonic

Abstract

Highly dispersed copper/multi-walled carbon nanotube (MWCNT) nanowires have been fabricated using ultrasonic-assisted electroless copper plating. The structures of the Cu/MWCNT nanowires were characterized by transmission electron microscopy (TEM), scanning electron microscopy (SEM), X-ray diffraction (XRD) and energy-dispersive X-ray spectroscopy (EDX). The study clearly demonstrates the advantages of the ultrasonic technique on electroless copper plating on MWCNT, including an enhanced electroless copper deposition rate, improved interfacial bonding as well as preventing Cu/MWCNT nanowires from aggregating. © 2009 Elsevier B.V. All rights reserved.

Publication Date

6-15-2009

Publication Title

Colloids and Surfaces A: Physicochemical and Engineering Aspects

Volume

342

Issue

1-3

Number of Pages

132-135

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1016/j.colsurfa.2009.04.030

Socpus ID

65649120808 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/65649120808

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