Title
Hot-Carrier Reliability And Breakdown Characteristics Of Multi-Finger Rf Mos Transistors
Abstract
Hot-carrier reliability and drain breakdown characteristics of multi-finger short channel MOS transistors are studied in detail. Several abnormal characteristics were observed. With the aid of numerical simulation, we found that the shared drain and source regions for adjacent gate fingers can lead to current crowding and result in the finger number-dependent current-voltage characteristics. In addition, the high current density spots near the drain region would result in the significant hot-carrier induced transconductance degradation as well as remarkable drain breakdown voltage lowering. © 2008 Elsevier Ltd. All rights reserved.
Publication Date
1-1-2009
Publication Title
Microelectronics Reliability
Volume
49
Issue
1
Number of Pages
13-16
Document Type
Article
Personal Identifier
scopus
DOI Link
https://doi.org/10.1016/j.microrel.2008.10.011
Copyright Status
Unknown
Socpus ID
58149105377 (Scopus)
Source API URL
https://api.elsevier.com/content/abstract/scopus_id/58149105377
STARS Citation
Wong, H.; Fu, Y.; Liou, J. J.; and Yue, Y., "Hot-Carrier Reliability And Breakdown Characteristics Of Multi-Finger Rf Mos Transistors" (2009). Scopus Export 2000s. 12486.
https://stars.library.ucf.edu/scopus2000/12486