Title

Reliability Of Pv Modules And Balance-Of-System Components

Abstract

Over the years the reliability and durability of c-Si and thin-film photovoltaic (PV) modules and balance-of-system (BOS) components have improved consistently. This paper reviews performance of PV modules and BOS components and discusses the role of encapsulants, adhesional strength, impurities, metallization, solder bond integrity and breakage, corrosion, backing layers, junction boxes and high-voltage bias testing in relation to their effect on module and inverter reliability. It is suggested that the concepts of physics of reliability of electronic packages will be useful to understand, address and resolve new problems in PV module and inverter reliability. © 2005 IEEE.

Publication Date

11-30-2005

Publication Title

Conference Record of the IEEE Photovoltaic Specialists Conference

Number of Pages

1570-1576

Document Type

Article; Proceedings Paper

DOI Link

https://doi.org/10.1109/PVSC.2005.1488445

Socpus ID

27944490467 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/27944490467

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