Title

Rf Saw Filter Package Design For Wireless Communications

Keywords

Electronic packaging; Finite-element method; RF SAW filter

Abstract

This paper describes a new method to design a ceramic chip and wire package for an RF SAW filter. Both the solid model of the package and bond wires are included in the full-wave analysis. A novel port configuration is used in finite-element simulation. Agreement between measurement and simulation is found to be excellent. © 2003 Wiley Periodicals, Inc.

Publication Date

12-5-2003

Publication Title

Microwave and Optical Technology Letters

Volume

39

Issue

5

Number of Pages

399-401

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1002/mop.11229

Socpus ID

0242303048 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/0242303048

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