Title

Applicability Of Dynamic Mechanical Analysis For Cmp Polyurethane Pad Studies

Keywords

Chemical-mechanical polishing; Dynamic mechanical analysis; Polyurethane

Abstract

Dynamic mechanical analysis (DMA) was used to obtain dynamic moduli of a standard industrial polishing pad before and after chemical-mechanical polishing (CMP). The multiple transitions found in the tan δ curve of the stacked pad are associated with the components present in the stacked pad. The effective dynamic storage modulus of an IC1000/Suba IV stacked pad showed a correlation with the elasticity of the individual pad materials. These dynamic studies provide evidence that in situ mechanical modifications play a greater role in pad material degradation than those due to chemical modifications. © 2003 Published by Elsevier Science Inc.

Publication Date

9-1-2002

Publication Title

Materials Characterization

Volume

49

Issue

2

Number of Pages

177-186

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1016/S1044-5803(03)00004-4

Socpus ID

0036771076 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/0036771076

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