Title

Electron Backscattering Diffraction Investigation Of Focused Ion Beam Surfaces

Keywords

Amorphous; Cu; Dual beam; EBSD; EBSP; FIB; FIB damage; Image quality; Si; TRIM

Abstract

A focused ion beam (FIB) instrument has been used to mill surfaces in single-crystal Si and single-crystal Cu for subsequent electron backscattering diffraction (EBSD) analysis. The FIB cuts were performed using a 30 keV and a 5 keV Ga+ ion beam at a stage tilt of 20° to provide a readily obtainable 70° surface for direct EBSD investigation in a scanning electron microscope (SEM). The quality of the patterns is related to the amount of FIB damage induced in the Cu and Si. These or similar methods should be directly transferable to a FIB/SEM dual beam instrument equipped with an EBSD detector.

Publication Date

1-1-2002

Publication Title

Journal of Electronic Materials

Volume

31

Issue

1

Number of Pages

33-39

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1007/s11664-002-0169-5

Socpus ID

0011194826 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/0011194826

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