Title
Interconnecting Microfluidic Package And Hybrid Interface For Chip-Based Sensor
Keywords
Interconnection; Microfluidic package; Portable analysis system; Sensor interface
Abstract
In realizing a portable chemical analysis system, adequate partitioning of a reusable component and a disposable is required. For successful implementation of micromachined sensors in an instrument, reliable methods for interconnection and interface are in great demand between these two major parts. In this work we investigated interconnection methods of micromachined chip devices and hybrid fluidic interface system. The interconnection method based on micromachining and injection molding techniques was developed and an interconnecting microfluidic package was designed, fabricated and tested. For the hybrid interface, sequencing of the chemical analysis was examined and accordingly, syringe containers, a peristaltic pump and pinch valves were assembled to compose a reliable meso-scale fluidic control unit. The system using the interconnecting package and the hybrid interface was tested for a chip-based sensor. Copyright © 2005 by ASME.
Publication Date
12-1-2005
Publication Title
American Society of Mechanical Engineers, Micro-Electro Mechanical Systems Division, (Publications) MEMS
Volume
7 MEMS
Number of Pages
177-181
Document Type
Article; Proceedings Paper
Personal Identifier
scopus
DOI Link
https://doi.org/10.1115/IMECE2005-82031
Copyright Status
Unknown
Socpus ID
33645963141 (Scopus)
Source API URL
https://api.elsevier.com/content/abstract/scopus_id/33645963141
STARS Citation
Palsandram, Naveenkumar S.; Zhang, Peng; and Pepper, Michael, "Interconnecting Microfluidic Package And Hybrid Interface For Chip-Based Sensor" (2005). Scopus Export 2000s. 3346.
https://stars.library.ucf.edu/scopus2000/3346