Title

Managing Heat For Electronics

Abstract

The important issues and current technologies of high thermal conductivity materials for electronics applications were analyzed. Thermal management is recognized to be an important aspect of computer design, with device performance being significantly affected by temperature. The challenge for thermal management is to develop high-conductivity structures that can accommodate the fixed temperature drop with the increasing power densities that characterize new generation of microprocessors. Attention was given to the special properties of one-dimensional structures that are likely to be of increasing importance in future applications.

Publication Date

1-1-2005

Publication Title

Materials Today

Volume

8

Issue

6

Number of Pages

30-35

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1016/S1369-7021(05)70935-4

Socpus ID

18844405477 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/18844405477

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