Title

Effect Of Hydrogen Peroxide On Oxidation Of Copper In Cmp Slurries Containing Glycine And Cu Sulfate

Abstract

This study compares the oxidative dissolution, passivation, and polishing behavior of copper chemical mechanical polishing in the presence of hydrogen peroxide, glycine and copper sulfate. High purity discs were used to study the dissolution and oxidation kinetics under static and dynamic conditions at pH 4 with varying H2O2 concentrations. Changes in surface chemistry of the statically etched copper-disc were investigated using X-ray photoelectron spectroscopy (XPS). With the addition of glycine and copper sulfate to the slurry, the copper removal rates increased significantly and the maximum removal rate shifted to a H2O2 concentration of 3%. Electrochemical investigation indicates an enhanced dissolution of copper, which might be due to the strong catalytic activity of Cu(II)-glycine complexes in decomposing H2O2 to yield hydroxyl radicals. XPS results suggest that the passivation at higher H2O2 concentrations in the presence of glycine and copper sulfate is provided by the OH radicals adsorbed on Cu surface.

Publication Date

1-1-2004

Publication Title

Materials Research Society Symposium Proceedings

Volume

816

Number of Pages

29-34

Document Type

Article; Proceedings Paper

Personal Identifier

scopus

DOI Link

https://doi.org/10.1557/proc-816-k1.4

Socpus ID

12744272467 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/12744272467

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