Title

On-Chip Bondwire Inductor With Ferrite-Epoxy Coating: A Cost-Effective Approach To Realize Power Systems On Chip

Keywords

Ferrite; On-chip inductor; SOC.; Wirebond

Abstract

A novel concept of on-chip bondwire inductors with ferrite epoxy coating is proposed to provide a cost effective approach realizing power systems on chip (SOC). A Q factor of 30-40 is experimentally demonstrated which represents an improvement by a factor of 3-30 over the state-of-the-art MEMS micromachined inductors. More importantly, the bondwire inductors can be easily integrated into power SOC manufacturing processes with minimal changes, and open enormous possibilities for realizing cost-effective, high current, high efficiency power SOC's. © 2007 IEEE.

Publication Date

12-1-2007

Publication Title

PESC Record - IEEE Annual Power Electronics Specialists Conference

Number of Pages

1599-1604

Document Type

Article; Proceedings Paper

Personal Identifier

scopus

DOI Link

https://doi.org/10.1109/PESC.2007.4342235

Socpus ID

48349111617 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/48349111617

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