Title

Spray Cooling Of Igbt Devices

Keywords

High heat flux; High power; IGBTs; Spray cooling

Abstract

The popularity and increased usage of insulated gate bipolar transistors (IGBTs) in power control systems have made the problem of cooling them a subject of considerable interest in recent years. In this investigation, a heat flux of 825 W/cm2 at the die was achieved when air-water spray cooling was used to cool IGBTs at high current levels. The junction temperature of the device was measured accurately through voltage-to-temperature characterization. Results from other cooling technologies and other spray cooling experiments were reviewed. A discussion of electrical power losses in IGBTs, due to switching and conduction, is included in this paper. Experiments were conducted on 19 IGBTs, using data collection and software control of the test set. Three types of cooling were explored in this investigation: single-phase convection with water, spray cooling with air-water and spray cooling with steam-water. The results of these experiments show clear advantages of air-water spray cooling IGBTs over other cooling technologies. The applications of spray cooling IGBTs are discussed in open (fixed) and closed (mobile) systems. Current and heat flux levels achieved during this investigation could not have been done using ordinary cooling methods. The techniques used in this investigation clearly demonstrate the superior cooling performance of air-water spray cooling over traditionell cooling methods. Copyright © 2007 by ASME.

Publication Date

9-1-2007

Publication Title

Journal of Electronic Packaging, Transactions of the ASME

Volume

129

Issue

3

Number of Pages

316-323

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1115/1.2753937

Socpus ID

38749086098 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/38749086098

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