Title

A Modified Back-Etch Method For Preparation Of Plan-View High-Resolution Transmission Electron Microscopy Samples

Keywords

Back-etch method; HRTEM; Sample preparation; Si; TEM; Thin films

Abstract

A modified back-etch method is described that has been successfully used to prepare samples of thin films and nanoparticles on Si wafer substrates for examination by high-resolution transmission electron microscopy (HRTEM). This process includes ultrasonic cutting, abrasive pre-thinning and a two-stage etching procedure. Unlike previous reports of back-etching methods, tetramethyl ammonium hydroxide, which has a very high-etching selectivity of Si to SiO 2, is used for the final etching to allow removal of the Si without degradation of the SiO2 membrane. An innovative wrapping method is also described. This novel approach reduces the preparation time for HRTEM samples to <1 h per sample for groups of 10 or more samples. As an example, the preparation of FePt nanoparticle samples for HRTEM imaging is described. © The Author 2006. Published by Oxford University Press on behalf of Japanese Society of Microscopy. All rights reserved.

Publication Date

8-1-2006

Publication Title

Journal of Electron Microscopy

Volume

55

Issue

4

Number of Pages

209-214

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1093/jmicro/dfl027

Socpus ID

33846210689 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/33846210689

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