Title

Femtosecond Fiber Laser Enables Reliable Wafer-Level Processing

Abstract

IMRA America has demonstrated an ultrashort-pulse fiber-laser system that enables reliable wafer-level processing. The demonstration reveals that the fiber laser system is capable of achieving improved die break strength, in comparison to other methods. The new system has enabled the company, to realize fiber-chirped pulse amplification (FCPA) in a robust compact package. It is observed that the FCPA-based femtosecond laser has improved, providing the reliability and performance, necessary for industrial applications. The large-core amplifier fiber provides single-transverse-mode output, while being insensitive to thermal lensing. The amplifier fiber is insensitive to thermal lensing, as beam propagation is defined by its waveguide nature.

Publication Date

12-1-2008

Publication Title

Laser Focus World

Volume

44

Issue

12

Number of Pages

61-64

Document Type

Article

Personal Identifier

scopus

Socpus ID

58149299899 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/58149299899

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