Title
Package Level Integration Of A Monolithic Buck Converter Power Ic And Bondwire Magnetics
Abstract
In this paper, we report a concept of integrating a monolithic buck converter power IC with in-package bondwire inductors. The power IC was designed and fabricated with a standard 0.5μm CMOS process. Multi-turn bondwires with and without ferrite epoxy glob cores are used as the filter inductor in the buck converter. A 2.5V/120mA prototype system in package (SiP) buck converter is built to operate at frequencies up to 5MHz. The power level of the prototype buck converter is scalable by increasing the size of the active power switches.
Publication Date
9-20-2010
Publication Title
Proceedings of the International Symposium on Power Semiconductor Devices and ICs
Number of Pages
51-54
Document Type
Article; Proceedings Paper
Personal Identifier
scopus
Copyright Status
Unknown
Socpus ID
77956579098 (Scopus)
Source API URL
https://api.elsevier.com/content/abstract/scopus_id/77956579098
STARS Citation
Jia, Hongwei; Lu, Jian; Wang, Xuexin; Padmanabhan, Karthik; and Shea, Patrick, "Package Level Integration Of A Monolithic Buck Converter Power Ic And Bondwire Magnetics" (2010). Scopus Export 2010-2014. 1011.
https://stars.library.ucf.edu/scopus2010/1011