Title
Controlled Electroplating And Electromigration In Nickel Electrodes For Nanogap Formation
Abstract
We report the fabrication of nickel nanospaced electrodes by electroplating and electromigration for nanoelectronic devices. Using a conventional electrochemical cell, nanogaps can be obtained by controlling the plating time alone and after a careful optimization of electrodeposition parameters such as electrolyte bath, applied potential, cleaning, etc. During the process, the gap width decreases exponentially with time until the electrode gaps are completely bridged. Once the bridge is formed, the ex situ electromigration technique can reopen the nanogap. When the gap is ∼1 nm, tunneling current-voltage characterization shows asymmetry which can be corrected by an external magnetic field. This suggests that charge transfer in the nickel electrodes depends on the orientation of magnetic moments. © 2010 IOP Publishing Ltd.
Publication Date
11-5-2010
Publication Title
Nanotechnology
Volume
21
Issue
44
Document Type
Article
Personal Identifier
scopus
DOI Link
https://doi.org/10.1088/0957-4484/21/44/445304
Copyright Status
Unknown
Socpus ID
77958526562 (Scopus)
Source API URL
https://api.elsevier.com/content/abstract/scopus_id/77958526562
STARS Citation
De Los Santos Valladares, Luis; Felix, Lizbet Leon; Dominguez, Angel Bustamante; Mitrelias, Thanos; and Sfigakis, Francois, "Controlled Electroplating And Electromigration In Nickel Electrodes For Nanogap Formation" (2010). Scopus Export 2010-2014. 14.
https://stars.library.ucf.edu/scopus2010/14