Title

A Stress Measurement Method For Alumina-Filled Adhesives Using Piezospectroscopy

Abstract

A new measurement method for determining the stress distribution within an adhesive due to applied loads using the photo-stimulated luminescence properties of α-alumina nanoparticles is presented. A single lap-shear design specimen was fabricated using fiberglass substrates coupled with an epoxy-adhesive dispersed with α-alumina nanoparticles. The specimen was subjected to known, incremental tensile loads while spectral data across the adhesive surface was captured simultaneously through the optically transparent fiberglass. Shifts were observed in the spectral lines of the embedded photo-luminescent α-alumina nanoparticles due to stress, also known as the piezospectroscopic effect. The spectral data at each load were analyzed and compared through contour maps, visually indicating differences in stress concentrations throughout the adhesive. Additionally, the contour maps illustrated trends in the stress distribution within the adhesive with increased load up to failure, as well as how the stress is affected by the quality of particle dispersion. Development of this method offers benefits of non-invasive monitoring of stress within adhesives with high spatial resolution. This is of significance to the development and testing of improved adhesives.

Publication Date

8-30-2011

Publication Title

International SAMPE Technical Conference

Number of Pages

-

Document Type

Article; Proceedings Paper

Personal Identifier

scopus

Socpus ID

80052065730 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/80052065730

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