Title

Evaluation Of Compact And Effective Air-Cooled Carbon Foam Heat Sink

Keywords

Carbon foam; Electronics cooling; Thermal management

Abstract

This study investigates a V-shaped corrugated carbon foam heat sink for thermal management of electronics with forced air convection. Experiments were conducted to determine the heat sink performance in terms of heat transfer coefficient and pressure drop. The test section, with overall dimensions of 51 mm L×51 mm W×19 mm H, enabled up to 166 W of heat dissipation, and 3280 W/ m2 K and 2210 W/ m2 K heat transfer coefficients, based on log mean and air inlet temperatures, respectively, at 7.8 m/s air flow speed, and 1320 Pa pressure loss. Compared to a solid carbon foam, the V-shaped corrugated structure enhances the heat transfer, and at the same time reduces the flow resistance. Physical mechanisms underlying the observed phenomena are briefly explained. With benefits that potentially can reduce overall weight, volume, and cost of the air-cooled electronics, the present V-shaped corrugated carbon foam emerges as an alternative heat sink. © 2011 American Society of Mechanical Engineers.

Publication Date

2-11-2011

Publication Title

Journal of Heat Transfer

Volume

133

Issue

5

Number of Pages

-

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1115/1.4003193

Socpus ID

79551695101 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/79551695101

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