Title

Femtosecond Laser Machining Of Multi-Depth Microchannel Networks Onto Silicon

Abstract

Direct writing of multi-depth microchannel branching networks into a silicon wafer with femtosecond pulses at 200 kHz is reported. The silicon wafer with the microchannels is used as the mold for rapid prototyping of microchannels on polydimethylsiloxane. The branching network is designed to serve as a gas exchanger for use in artificial lungs and bifurcates according to Murray's law. In the development of such micro-fluidic structures, processing speed, machining range with quality surface, and precision are significant considerations. The scan speed is found to be a key parameter to reduce the processing time, to expand the machining range, and to improve the surface quality. By fabricating a multi-depth branching network as an example, the utilization of femtosecond pulses in the development of microfluidic devices is demonstrated. © 2011 IOP Publishing Ltd.

Publication Date

4-1-2011

Publication Title

Journal of Micromechanics and Microengineering

Volume

21

Issue

4

Number of Pages

-

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1088/0960-1317/21/4/045027

Socpus ID

79953649536 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/79953649536

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