Title

Fabrication Of Pb-Free Sn-Bi Solder Using Polyoxyethylene Lauryl Ether

Keywords

Electrochemical deposition; Polyoxyethylene lauryl ether; Sn-Bi alloy

Abstract

Lead-free solders have been gaining more and more attention recently. Sn-Bi system is one of the most promising candidates as the lead-free solder materials. In this article Polyoxyethylene lauryl ether (Brij 35) was used as the additive in the electrochemical deposition of Sn-Bi alloy. Various current densities and bath compositions have been investigated. Sn-Bi composites were successfully deposited on a copper substrate. The deposits were then characterized and studied by scanning electron microscopic (SEM), energy dispersive X-ray spectroscopy (EDS), X-ray diffraction (XRD) and differential scanning calorimeter (DSC). Results indicate that the morphology and crystalline orientations are composition dependent. Intermetallic compound (IMC) was formed during the reflow process. © (2012) Trans Tech Publications, Switzerland.

Publication Date

11-23-2012

Publication Title

Advanced Materials Research

Volume

569

Number of Pages

159-163

Document Type

Article; Proceedings Paper

Personal Identifier

scopus

DOI Link

https://doi.org/10.4028/www.scientific.net/AMR.569.159

Socpus ID

84869207591 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/84869207591

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