Title

Numerical Study Of Atomic Diffusion Processes Of Copper On Silver (110) Surface: Cu/Ag (110)

Keywords

Jump rate; Molecular dynamics simulation; Surface diffusion; Velocity correlation function

Abstract

The aim of this paper is to study the diffusion of Cu adatom on Ag (110) by using the molecular dynamics simulation in the framework of the embedded atom method (EAM) as model of atomic interaction. Our simulation results predict that several diffusion processes such as simple jump, long jump and exchange mechanism may occur in the same system. The static barrier is calculated for each process by the drag method. The dynamic activation energy calculated from the Arrhenius law is in a good agreement with the static barrier. The presence of double jump is studied using velocity correlation function showing small contributions in diffusion process. Implications of these findings are discussed in more details.

Publication Date

1-1-2012

Publication Title

Journal of Optoelectronics and Advanced Materials

Volume

14

Issue

11-12

Number of Pages

1059-1065

Document Type

Article

Personal Identifier

scopus

Socpus ID

84872110074 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/84872110074

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