Title

An Integrated Saw Sensor With Direct Write Antenna

Abstract

This paper presents a wafer-level integrated SAW sensor that uses conventional thin-film fabrication for the SAW, and the direct write of a thicker dissimilar metal for the antenna. An automated thermal spray process deposits the antenna conductor onto the SAW substrate, providing ease of fabrication, optimal film thickness, superior adhesion, and application specific materials. Results will highlight the direct printing of thick copper traces onto whole LiNbO3 wafers. The design of a 915 MHz meandered dipole antenna with low mismatch loss and maximized radiation efficiency over a 7% SAW fractional bandwidth is demonstrated. Experimental performance results of antennas fabricated on standard FR4 and on-wafer by the direct write process are contrasted. Temperature sensors are fabricated on YZ-LiNbO3 and their wireless performance is evaluated. © 2013 IEEE.

Publication Date

12-1-2013

Publication Title

2013 Joint European Frequency and Time Forum and International Frequency Control Symposium, EFTF/IFC 2013

Number of Pages

450-453

Document Type

Article; Proceedings Paper

Personal Identifier

scopus

DOI Link

https://doi.org/10.1109/EFTF-IFC.2013.6702092

Socpus ID

84893299346 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/84893299346

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