Title

A Fully-Integrated Flexible Photonic Platform For Chip-To-Chip Optical Interconnects

Keywords

Data communications; energy per bit; optical interconnects; optical waveguides

Abstract

We analyze a chip-to-chip optical interconnect platform based on our recently developed flexible substrate integration technology. We show that the architecture achieves high bandwidth density (100 Tbs/cm 2), and does not require optical alignment during packaging. These advantages make the flexible photonics platform a promising solution for chip-to-chip optical interconnects. We further report initial experimental characterizations of the flexible photonics platform fabricated using thermal nanoimprint patterning of glass waveguides and III-V die bonding. © 2013 IEEE.

Publication Date

12-15-2013

Publication Title

Journal of Lightwave Technology

Volume

31

Issue

24

Number of Pages

4080-4086

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1109/JLT.2013.2285382

Socpus ID

84890039202 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/84890039202

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