Title

Silicon Backside Machining Using A Nanosecond 2-Μm Tm:Fiber Laser

Abstract

Utilizing the transparency of silicon at 2 μm, we are able to ablate the backside of 500-μm thick silicon wafers without causing any damage to the front surface using a novel nanosecond Tm:fiber laser system. We report on our high energy/high peak power nanosecond Tm:fiber laser and provide an initial description of the effects of laser parameters such as pulse duration and energy density on the ablation, and compare thresholds for front and backside machining. The ability to selectively machine the backside of silicon wafers without disturbing the front surface may lead to new processing techniques for advanced manufacturing in solar cell and microelectronics industries. © 2013 Copyright SPIE.

Publication Date

5-29-2013

Publication Title

Proceedings of SPIE - The International Society for Optical Engineering

Volume

8612

Number of Pages

-

Document Type

Article; Proceedings Paper

Personal Identifier

scopus

DOI Link

https://doi.org/10.1117/12.2004878

Socpus ID

84878155903 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/84878155903

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