Title
Overcoming Multi Finger Turn-On In Hv Diacs Using Local Polv-Ballasting
Abstract
Miscorrelation between TLP. IEC contact and IEC air-gap high current capability of dual- direction DIAC devices is experimentally observed and explained by non-simultaneous turn on the DIAC device fingers. The effect is studied using numerical simulation, followed by the experimental validation of the new proposed design with poly-emitter ballasting.
Publication Date
11-26-2014
Publication Title
Electrical Overstress/Electrostatic Discharge Symposium Proceedings
Volume
2014-November
Issue
November
Number of Pages
-
Document Type
Article; Proceedings Paper
Personal Identifier
scopus
Copyright Status
Unknown
Socpus ID
84938153261 (Scopus)
Source API URL
https://api.elsevier.com/content/abstract/scopus_id/84938153261
STARS Citation
Aliaj, B.; Vashcheiiko, V. A.; Liou, J. J.; and Mitchell, T., "Overcoming Multi Finger Turn-On In Hv Diacs Using Local Polv-Ballasting" (2014). Scopus Export 2010-2014. 8289.
https://stars.library.ucf.edu/scopus2010/8289