Overcoming Multi Finger Turn-On In Hv Diacs Using Local Polv-Ballasting
Miscorrelation between TLP. IEC contact and IEC air-gap high current capability of dual- direction DIAC devices is experimentally observed and explained by non-simultaneous turn on the DIAC device fingers. The effect is studied using numerical simulation, followed by the experimental validation of the new proposed design with poly-emitter ballasting.
Electrical Overstress/Electrostatic Discharge Symposium Proceedings
Number of Pages
Article; Proceedings Paper
Source API URL
Aliaj, B.; Vashcheiiko, V. A.; Liou, J. J.; and Mitchell, T., "Overcoming Multi Finger Turn-On In Hv Diacs Using Local Polv-Ballasting" (2014). Scopus Export 2010-2014. 8289.