Title
Chip-To-Chip Optical Interconnects Based On Flexible Integrated Photonics
Keywords
Adhesive bonding; Energy efficiency; Flexible photonics; Nanoimprint; Optical interconnects; Resonators; Waveguides
Abstract
A high bandwidth density chip-to-chip optical interconnect architecture is analyzed. The interconnect design leverages our recently developed flexible substrate integration technology to circumvent the optical alignment requirement during packaging. Initial experimental results on fabrication and characterization of the flexible photonic platform are also presented. © 2014 SPIE.
Publication Date
1-1-2014
Publication Title
Proceedings of SPIE - The International Society for Optical Engineering
Volume
8991
Number of Pages
-
Document Type
Article; Proceedings Paper
Personal Identifier
scopus
DOI Link
https://doi.org/10.1117/12.2037812
Copyright Status
Unknown
Socpus ID
84901776832 (Scopus)
Source API URL
https://api.elsevier.com/content/abstract/scopus_id/84901776832
STARS Citation
Li, Lan; Zou, Yi; Lin, Hongtao; Hu, Juejun; and Sun, Xiaochen, "Chip-To-Chip Optical Interconnects Based On Flexible Integrated Photonics" (2014). Scopus Export 2010-2014. 9315.
https://stars.library.ucf.edu/scopus2010/9315