Title

Correlation Between Tlp, Hmm, And System-Level Esd Pulses For Cu Metallization

Keywords

Back end of line (BEOL); ESD; IEC system level

Abstract

Correlation factors between different ESD pulse types for different back-end-of-line (BEOL) metal-line topologies have been studied to support system-level on-chip ESD design. The component level (HMM, HBM, and TLP on a wafer) and system-level (IEC gun contact on package) ESD stresses were correlated followed by extraction of correlation factors between the IEC/HMM and TLP, as well as the HBM and TLP supported by analytical approximation. The major conclusions were verified using the thermal coupled mixed-mode simulation analysis. © 2013 IEEE.

Publication Date

1-1-2014

Publication Title

IEEE Transactions on Device and Materials Reliability

Volume

14

Issue

1

Number of Pages

446-450

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1109/TDMR.2013.2292039

Socpus ID

84898453348 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/84898453348

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