Study Of The Long Term Reliability Of 3D Ic Under Near-Application Conditions

Keywords

3D Integration; Fatigue; FEA; Intermetallics Compounds; Micro-Bumps; Reliability

Abstract

In this work, the long-term reliability of a 3D IC component was investigated through experimental and numerical simulation approaches. Multiple types of acceleration tests were carried out. In addition to commonly used accelerate test condition such as high temperature storage, novel testing condition including a combined storage and temperature cycling was adopted to emulate some real-life use conditions. Reliability of the component was assessed primarily by inspecting the microstructure evolution in the micro-bumps connecting the chip stacks. Formation and growth rate of intermetallic compounds (IMCs) as well as micro-cracks were the focus areas. IMCs and cracks were analyzed using characterization techniques including scanning electron microscopy (SEM) and energy dispersive x-ray spectroscopy (EDS). A 3D multi-level finite element analysis (FEA) was conducted on the component. Micro-bumps locations with high concentration of stresses were identified with simulation results and correlation with actual experimental observations was established.

Publication Date

8-7-2018

Publication Title

Proceedings - Electronic Components and Technology Conference

Volume

2018-May

Number of Pages

476-482

Document Type

Article; Proceedings Paper

Personal Identifier

scopus

DOI Link

https://doi.org/10.1109/ECTC.2018.00076

Socpus ID

85051922789 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/85051922789

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