Thermal Behavior Of A Microdevice Under Transient Heat Loads
Keywords
Air; HFE-7000; Microscale; Pulse; Step change in heat flux; Transient
Abstract
An experimental study was carried out to investigate the transient response of a thermal microsystem to both a step change and a square wave pulse change in heat flux. The microsystem consisted of a single microchannel etched on a silicon microdevice that was bonded to a Pyrex wafer. A thin-film titanium heater was deposited on the Pyrex substrate. The heater acted as the power source as well as the resistance temperature device. The influence of flow convection on the transient response was studied for two fluids: air and HFE-7000. The effects of heat flux, Reynolds number, fluid properties, and pulse parameters (amplitude, width, duty cycle) on the transient temperature response were identified. The temperature response consisted of an initial rapid temperature rise followed by slower convection dynamics. For longer pulse widths, the temperature of the microdevice reached steady state. Higher order dynamics were identified at the beginning of the temperature response. Convection dynamics were approximated as a first-order response, and the effects of Reynolds number and fluid properties on the time constant of the first order response were identified.
Publication Date
12-1-2015
Publication Title
International Journal of Heat and Mass Transfer
Volume
91
Number of Pages
1078-1087
Document Type
Article
Personal Identifier
scopus
DOI Link
https://doi.org/10.1016/j.ijheatmasstransfer.2015.08.043
Copyright Status
Unknown
Socpus ID
84940707231 (Scopus)
Source API URL
https://api.elsevier.com/content/abstract/scopus_id/84940707231
STARS Citation
Basu, Saptarshi; Werneke, Brian; Peles, Yoav; and Jensen, Michael K., "Thermal Behavior Of A Microdevice Under Transient Heat Loads" (2015). Scopus Export 2015-2019. 218.
https://stars.library.ucf.edu/scopus2015/218