Correlating Wafer Surface To Dw Saw Profile And Wire Wear

Keywords

crystal silicon wafering; diamond wire; surface morphology

Abstract

The surface of diamond-wire sawn wafers is investigated as a function of different wires. The evolution of the pilgrim waves on the wafer surface is correlated with wire movement. Analysis of wafer surfaces indicated that some wires generate lower surface roughness than others, even using the same sawing recipe.

Publication Date

11-18-2016

Publication Title

Conference Record of the IEEE Photovoltaic Specialists Conference

Volume

2016-November

Number of Pages

618-622

Document Type

Article; Proceedings Paper

Personal Identifier

scopus

DOI Link

https://doi.org/10.1109/PVSC.2016.7749672

Socpus ID

85003422108 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/85003422108

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