Title
Correlating Wafer Surface To Dw Saw Profile And Wire Wear
Keywords
crystal silicon wafering; diamond wire; surface morphology
Abstract
The surface of diamond-wire sawn wafers is investigated as a function of different wires. The evolution of the pilgrim waves on the wafer surface is correlated with wire movement. Analysis of wafer surfaces indicated that some wires generate lower surface roughness than others, even using the same sawing recipe.
Publication Date
11-18-2016
Publication Title
Conference Record of the IEEE Photovoltaic Specialists Conference
Volume
2016-November
Number of Pages
618-622
Document Type
Article; Proceedings Paper
Personal Identifier
scopus
DOI Link
https://doi.org/10.1109/PVSC.2016.7749672
Copyright Status
Unknown
Socpus ID
85003422108 (Scopus)
Source API URL
https://api.elsevier.com/content/abstract/scopus_id/85003422108
STARS Citation
Brooker, R. Paul; Seigneur, Hubert P.; and Schoenfeld, Winston V., "Correlating Wafer Surface To Dw Saw Profile And Wire Wear" (2016). Scopus Export 2015-2019. 4500.
https://stars.library.ucf.edu/scopus2015/4500