Local Heat Transfer In A Microchannel With A Pin Fin—Experimental Issues And Methods To Mitigate

Keywords

Flow wake; Local heat transfer coefficient; Local temperature measurements; Microchannel; Pin fin; RTD; μPIV

Abstract

Local heat transfer downstream a single pin fin in a microchannel was experimentally studied by incorporating an array of micro resistance temperature detectors (RTD) (∼55 μm × 55 μm) on the internal microchannel surface. Local temperature distribution with spatial resolution as high as 150 μm was obtained and was superimposed onto the velocity field to reveal the interaction between the flow structure and the local heat transfer at different regions downstream the pin fin. Initial result in which the surface temperature inside the steady wake region was lower than in the regions outside the recirculation zone was explained and linked to an interplay of fluid convection and solid substrate conduction. Ignoring this local interplay and processing the data without careful consideration to the conduction process resulted in misinterpretation of the heat transfer processes. To address this issue numerical thermal and fluid model of the entire device was simulated to provide local heat flux distribution. This in turn allowed to resolve the local heat transfer coefficient in the vicinity, and outside the region, of the pin fin.

Publication Date

3-1-2017

Publication Title

International Journal of Heat and Mass Transfer

Volume

106

Number of Pages

1191-1204

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1016/j.ijheatmasstransfer.2016.10.100

Socpus ID

85003037199 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/85003037199

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