A 48-Well Transparent Microelectrode Array Fabricated Utilizing A Flexible, 'Wrapped Around' Interconnect Technology

Keywords

Biosensors; Interconnects; Microelectrode Arrays

Abstract

This paper describes the microfabrication, assembly and preliminary characterization of a flexible multi-layer circuit wrapped around a base plate utilized as a high-throughput 48-well Microelectrode Array (MEA) device. Roll to roll flexible circuit technology allows for fine lines and spaces (<25 μm) to be fabricated in a large area fashion and has been exploited for the first time to our knowledge toward a high-throughput MEA application. Utilizing this technology to develop a microelectrode array has the opportunity to provide cost-effective, disposable consumable devices to the high-throughput biotechnology and biosensor screening markets. The flexibility allows for the circuit to be wrapped around a rigid substrate, thereby allowing backside interconnectivity and eliminating the need for expensive conductive through vias and lowering the number of processing steps. This device has been further assembled and characterized.

Publication Date

1-5-2017

Publication Title

Proceedings of IEEE Sensors

Document Type

Article; Proceedings Paper

Personal Identifier

scopus

DOI Link

https://doi.org/10.1109/ICSENS.2016.7808446

Socpus ID

85010952171 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/85010952171

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