Correlating Wafer Surface To Dw Saw Profile And Wire Wear

Keywords

Crystal silicon wafering; Diamond wire; Surface morphology

Abstract

The surface of diamond-wire sawn wafers is investigated as a function of different wires. The evolution of the pilgrim waves on the wafer surface is correlated with wire movement. Analysis of wafer surfaces indicated that some wires generate lower surface roughness than others, even using the same sawing recipe.

Publication Date

1-1-2017

Publication Title

2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017

Number of Pages

361-364

Document Type

Article; Proceedings Paper

Personal Identifier

scopus

DOI Link

https://doi.org/10.1109/PVSC.2017.8366073

Socpus ID

85048498216 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/85048498216

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