Title
Correlating Wafer Surface To Dw Saw Profile And Wire Wear
Keywords
Crystal silicon wafering; Diamond wire; Surface morphology
Abstract
The surface of diamond-wire sawn wafers is investigated as a function of different wires. The evolution of the pilgrim waves on the wafer surface is correlated with wire movement. Analysis of wafer surfaces indicated that some wires generate lower surface roughness than others, even using the same sawing recipe.
Publication Date
1-1-2017
Publication Title
2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017
Number of Pages
361-364
Document Type
Article; Proceedings Paper
Personal Identifier
scopus
DOI Link
https://doi.org/10.1109/PVSC.2017.8366073
Copyright Status
Unknown
Socpus ID
85048498216 (Scopus)
Source API URL
https://api.elsevier.com/content/abstract/scopus_id/85048498216
STARS Citation
Brooker, R. Paul; Seigneur, Hubert P.; and Schoenfeld, Winston V., "Correlating Wafer Surface To Dw Saw Profile And Wire Wear" (2017). Scopus Export 2015-2019. 7174.
https://stars.library.ucf.edu/scopus2015/7174