Nonplanar Focal Plane With Silicon Based Photodetector

Abstract

A fabrication process is demonstrated to form curved image sensors based on CMOS image sensor technology. A stretchable polymer backplane is fabricated monolithically on the backside of the wafer before a DRIE etch is performed to segment the wafer and make the circuit stretchable.

Publication Date

11-20-2017

Publication Title

30th Annual Conference of the IEEE Photonics Society, IPC 2017

Volume

2017-January

Number of Pages

55-56

Document Type

Article; Proceedings Paper

Personal Identifier

scopus

DOI Link

https://doi.org/10.1109/IPCon.2017.8116004

Socpus ID

85043500225 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/85043500225

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