Rgb-Stack Light Emitting Diode Modules With Transparent Glass Circuit Board And Oil Encapsulation

Keywords

Cooling oil encapsulation; FCLED; Stacking module; Transparent glass circuit board

Abstract

The light emitting diode (LED) is widely used in modern solid-state lighting applications, and its output efficiency is closely related to the submounts' material properties. Most submounts used today, such as low-power printed circuit boards (PCBs) or high-power metal core printed circuit boards (MCPCBs), are not transparent and seriously decrease the output light extraction. To meet the requirements of high light output and better color mixing, a three-dimensional (3-D) stacked flip-chip (FC) LED module is proposed and demonstrated. To realize light penetration and mixing, the mentioned 3-D vertically stacking RGB LEDs use transparent glass as FC package submounts called glass circuit boards (GCB). Light emitted from each GCB stacked LEDs passes through each other and thus exhibits good output efficiency and homogeneous light-mixing characteristics. In this work, the parasitic problem of heat accumulation, which caused by the poor thermal conductivity of GCB and leads to a serious decrease in output efficiency, is solved by a proposed transparent cooling oil encapsulation (OCP) method.

Publication Date

3-1-2018

Publication Title

Materials

Volume

11

Issue

3

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.3390/ma11030365

Socpus ID

85042781089 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/85042781089

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