Compact Thermal Failure Model For Devices Subject To Electrostatic Discharge Stresses

Keywords

Circuit simulation; Energy dissipation; Heat transfer

Abstract

A leading cause of device failure under electrostatic discharge stress conditions is thermal failure. This failure occurs as a result of excessive energy dissipation which raises the temperature of the device to a critical breaking level. To predict such a physical failure at circuit level, a compact model compatible with circuit simulators is proposed. The model is derived from the fundamental heat transfer equations and is shown to accurately predict thermal failure for arbitrary electrical stress waveforms.

Publication Date

12-1-2015

Publication Title

IEEE Transactions on Electron Devices

Volume

62

Issue

12

Number of Pages

4128-4134

Document Type

Article

Personal Identifier

scopus

DOI Link

https://doi.org/10.1109/TED.2015.2491223

Socpus ID

84959349802 (Scopus)

Source API URL

https://api.elsevier.com/content/abstract/scopus_id/84959349802

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