Title
Editorial: Iedms 2016
Publication Date
4-1-2018
Publication Title
Microelectronics Reliability
Volume
83
Number of Pages
207-
Document Type
Editorial Material
Personal Identifier
scopus
DOI Link
https://doi.org/10.1016/j.microrel.2017.12.037
Copyright Status
Unknown
Socpus ID
85040109838 (Scopus)
Source API URL
https://api.elsevier.com/content/abstract/scopus_id/85040109838
STARS Citation
Liu, Chuan Hsi; Cheng, Chun Hu; Cheng, Chin Pao; and Liou, Juin J., "Editorial: Iedms 2016" (2018). Scopus Export 2015-2019. 9578.
https://stars.library.ucf.edu/scopus2015/9578
COinS