Skin effect of on-chip copper interconnects on electromigration
Abbreviated Journal Title
skin effect; copper interconnect; electromigration; reduced vacancy; concentration; mean time to failure; Engineering, Electrical & Electronic; Physics, Applied; Physics, ; Condensed Matter
A simple model is derived to evaluate skin effect of on-chip copper interconnects on electromigration. The result gives the range of frequency in which skin effect on electromigration need to be taken into consideration. (C) 2002 Elsevier Science Ltd. All rights reserved.
"Skin effect of on-chip copper interconnects on electromigration" (2002). Faculty Bibliography 2000s. 3555.