Title

Skin effect of on-chip copper interconnects on electromigration

Authors

Authors

W. Wu;J. S. Yuan

Comments

Authors: contact us about adding a copy of your work at STARS@ucf.edu

Abbreviated Journal Title

Solid-State Electron.

Keywords

skin effect; copper interconnect; electromigration; reduced vacancy; concentration; mean time to failure; Engineering, Electrical & Electronic; Physics, Applied; Physics, ; Condensed Matter

Abstract

A simple model is derived to evaluate skin effect of on-chip copper interconnects on electromigration. The result gives the range of frequency in which skin effect on electromigration need to be taken into consideration. (C) 2002 Elsevier Science Ltd. All rights reserved.

Journal Title

Solid-State Electronics

Volume

46

Issue/Number

12

Publication Date

1-1-2002

Document Type

Article

DOI Link

http://dx.doi.org/10.1016/s0038-1101(02)00232-0

Language

English

First Page

2269

Last Page

2272

WOS Identifier

WOS:000179517100036

ISSN

0038-1101

Recommended Citation

"Skin effect of on-chip copper interconnects on electromigration" (2002). Faculty Bibliography 2000s. 3555.
https://stars.library.ucf.edu/facultybib2000/3555