Skin effect of on-chip copper interconnects on electromigration

    Authors

    W. Wu;J. S. Yuan

    Comments

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    Abbreviated Journal Title

    Solid-State Electron.

    Keywords

    skin effect; copper interconnect; electromigration; reduced vacancy; concentration; mean time to failure; Engineering, Electrical & Electronic; Physics, Applied; Physics, ; Condensed Matter

    Abstract

    A simple model is derived to evaluate skin effect of on-chip copper interconnects on electromigration. The result gives the range of frequency in which skin effect on electromigration need to be taken into consideration. (C) 2002 Elsevier Science Ltd. All rights reserved.

    Journal Title

    Solid-State Electronics

    Volume

    46

    Issue/Number

    12

    Publication Date

    1-1-2002

    Document Type

    Article

    Language

    English

    First Page

    2269

    Last Page

    2272

    WOS Identifier

    WOS:000179517100036

    ISSN

    0038-1101

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