Integration of a Monolithic Buck Converter Power IC and Bondwire Inductors With Ferrite Epoxy Glob Cores
Abbreviated Journal Title
IEEE Trans. Power Electron.
Bondwire magnetics; buck converter; integrated inductor; power-supply-in-a-package (PSiP); power-supply-on-a-chip (PSoC); DC-DC CONVERTER; SILICON; FUTURE; CHIP; Engineering, Electrical & Electronic
In this letter, we report a concept of integrating a monolithic buck converter power IC with in-package bondwire inductors. The power IC containing all switching devices, driver circuitry, and control logic was designed and fabricated with a standard 0.5-mu m CMOS process. Mutliturn bondwires with and without ferrite epoxy glob cores are used as the filter inductor in the buck converter. A prototype system-in-package converter with an output voltage and current of 2.5V and 120 mA was built to operate at frequencies up to 5 MHz. The power level of the prototype buck converter is scalable by increasing the size of the active power switches.
Ieee Transactions on Power Electronics
"Integration of a Monolithic Buck Converter Power IC and Bondwire Inductors With Ferrite Epoxy Glob Cores" (2011). Faculty Bibliography 2010s. 1434.