Integration of a Monolithic Buck Converter Power IC and Bondwire Inductors With Ferrite Epoxy Glob Cores

Authors

    Authors

    H. W. Jia; J. Lu; X. X. Wang; K. Padmanabhan;Z. J. Shen

    Comments

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    Abbreviated Journal Title

    IEEE Trans. Power Electron.

    Keywords

    Bondwire magnetics; buck converter; integrated inductor; power-supply-in-a-package (PSiP); power-supply-on-a-chip (PSoC); DC-DC CONVERTER; SILICON; FUTURE; CHIP; Engineering, Electrical & Electronic

    Abstract

    In this letter, we report a concept of integrating a monolithic buck converter power IC with in-package bondwire inductors. The power IC containing all switching devices, driver circuitry, and control logic was designed and fabricated with a standard 0.5-mu m CMOS process. Mutliturn bondwires with and without ferrite epoxy glob cores are used as the filter inductor in the buck converter. A prototype system-in-package converter with an output voltage and current of 2.5V and 120 mA was built to operate at frequencies up to 5 MHz. The power level of the prototype buck converter is scalable by increasing the size of the active power switches.

    Journal Title

    Ieee Transactions on Power Electronics

    Volume

    26

    Issue/Number

    6

    Publication Date

    1-1-2011

    Document Type

    Article

    Language

    English

    First Page

    1627

    Last Page

    1630

    WOS Identifier

    WOS:000293750400004

    ISSN

    0885-8993

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