Abstract

Electromigration reliability of ball-grid-array (BGA) solder joints is emerging as a critical area of research for advanced microelectronic devices, especially those with high power requirements. In this study, a novel high current electromigration test system, including a temperature sensing capability, was designed and developed for the purpose of performing electromigration characterization of various BGA solder joint structures, including features designed for reduced current crowding. This study consisted of two main parts: design and development of a novel high current electromigration test system, and using this novel system for electromigration characterization of BGA solder joints. In the first portion of this study, a novel high current electromigration test system was successfully developed and validated through the use of mock samples. In the second portion of the study, this test system was used to perform an electromigration experiment on a legacy BGA solder structure for characterization of failure modes and mechanisms. It was found that electromigration failure in BGA solder joints occurs due to mass transport of solder from the cathode to the anode of a solder joint and ultimately the breakdown of copper traces in the substrate. This study is significant because electromigration in BGA solder joints is not well understood and has not been studied historically due to the difficulty of stressing these joints to highly accelerated conditions. However, in this study, electromigration characteristics in BGA solder joints were able to be investigated through the use of the novel electromigration test system developed.

Notes

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Graduation Date

2023

Semester

Spring

Advisor

Jiang, Tengfei

Degree

Master of Science in Materials Science and Engineering (M.S.M.S.E.)

College

College of Engineering and Computer Science

Department

Materials Science and Engineering

Degree Program

Materials Science and Engineering

Identifier

CFE0009866; DP0028145

URL

https://purls.library.ucf.edu/go/DP0028145

Language

English

Release Date

November 2023

Length of Campus-only Access

None

Access Status

Masters Thesis (Open Access)

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