Stress-dependent piezoresistivity of tunneling-percolation systems

    Authors

    Y. S. Wang; L. G. Zhang; Y. Fan; D. P. Jiang;L. A. An

    Comments

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    Abbreviated Journal Title

    J. Mater. Sci.

    Keywords

    THICK-FILM RESISTORS; CONDUCTIVITY EXPONENT; PRECISE DETERMINATION; TEMPERATURE BEHAVIOR; SICN MEMS; COMPOSITES; THRESHOLD; FABRICATION; MECHANISMS; RESISTANCE; Materials Science, Multidisciplinary

    Abstract

    We studied the stress-dependent piezoresistive behavior of tunneling-percolation systems. Starting from percolation-like power law of resistivity, a model relating piezoresistive stress coefficient to the applied stress has been developed by considering the stress-induced changes in the critical exponent and that in the concentration of conducting phases. It is found that the coefficient exhibits reverse and logarithmic dependence on the applied stress in the different stress ranges. We show that the experimental data, obtained from carbon-reinforced polymer composites and polymer-derived ceramics, follow the theoretical prediction of the model very well, indicating that the stress effects described by the model indeed exist in tunneling-percolation systems.

    Journal Title

    Journal of Materials Science

    Volume

    44

    Issue/Number

    11

    Publication Date

    1-1-2009

    Document Type

    Article

    Language

    English

    First Page

    2814

    Last Page

    2819

    WOS Identifier

    WOS:000265298300012

    ISSN

    0022-2461

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